Gather round, consumers, for yet another Apple rumour.
TSMC, Apple's exclusive chip manufacturing supplier, has reportedly started production on the next-generation A13 chip meant to go into the next three iPhones.
TSMC has had the A13 chip in test production since April say reports, and is set for mass production later this month. That's ahead of schedule, according to Tom's Hardware. The report states that the 2019 iPhone 11 and iPhone 11 Max are codenamed D43 and D43, with the iPhone XR known internally as N104.
On the other hand, it's important to note that the other iPhones launching this year could come with a triple-camera setup on the back, so iPhone XR would continue to be positioned as the more affordable version of the three. The A13 chip will land in successors to last year's iPhone XS Max, iPhone XS, and iPhone XR models.
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But the real surprise is what you'll be able to do with the rumored third camera.The 2019 iPhones should be getting a third camera with an ultra-wide lens. It will also enable a broader range of zoom.
As the primary benefits of the new 7nm EUV process are 17% transistor density and 10% reduction in power, compared to DUV, we may see Apple will focus primarily on increasing the transistor count on its A13 chip, which may or may not result in a significant jump in performance over the A12 used in current-generation iPhones. There will also be an auto-correction feature in which people who were accidentally cut out from a photo can be added back into it.
Additionally, all three models will have reverse wireless charging, allowing users to charge compatible devices by stacking them on the back of the phone - a feature already included in Samsung and Huawei phones.